Description

• Removal leaves little or no residue
• Masking off PCBs for IR reflow ovens or wave soldering under 572F (300C) ~ 10 seconds
• Near zero voltage generation when tape removed from PCB (at 50% relative humidity)
• Near zero voltage generation when tape unrolled from roll (at 50% relative humidity)
• Low sloughing plastic core
• Ideal for masking gold leads and other components on boards populated with sensitive integrated circuits
• For best results, apply to board using a rubber roller
• 1.0 mil thick (0.0254 mm) polyimide film (DuPont Kapton or equivalent)
• 1.4 mil thick (0.0356 mm) conductive polysiloxide adhesive
• Adhesive surface resistivity 10E3 to 10E4 ohms
• Max temperature 300C (572F), 10 seconds
• Lead-free RoHS compliant