Description

AIM DJAW-10 understencil wipe solvent is compatible with all AIM no clean and water soluble solder pastes. DJAW-10 is formulated for hand application or by automated understencil wiper. DJAW-10 stencil cleaner is proven to reduce solder paste dry-out while enhancing paste release from the finest apertures. Use of DJAW-10 can reduce wipe cycles by 50% versus IPA alone. DJAW-10 dries quickly leaving minimal residue.

DJAW-10 is available in 1 gallon, and 5 gallon containers.

Product Features:

• Compatible with all AIM Solder Pastes
• Use in Place of Isopropyl Alcohol (IPA)
• Enhances Paste Life and Performance
• Hand or Machine Apply
• Reduces Wipe Frequency
• Reduces Aperture Clogging

* This item is restricted to UPS Ground Shipping. Hazardous Materials Shipping Charges are included.

Technical Data Sheet
Safety Data Sheet